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Apple, Samsung working on heat-pipe cooling for upcoming phones?

Written by Andre Yoskowitz (Google+) @ 21 Jun 2013 11:41 User comments (4)

Apple, Samsung working on heat-pipe cooling for upcoming phones? According to Digitimes, Apple and Samsung have begun developing ultra-thin heat pipes for their upcoming smartphones, with the potential to reveal "heat pipe-adopted models in the fourth quarter."
The companies would not be the first to launch such a model, as NEC just unveiled their Medias X06E, a smartphone with a 4.7-inch 1,280x720 OLED display, a 1.7GHz Qualcomm Snapdragon S4 Pro 4 processor and heat pipes for improved cooling.

Digi says the "conventional graphite plus foil cooling method is no longer able to dissipate enough heat in modern smartphone models efficiently" mainly thanks to the standardization of LTE chips.

Ultrabooks currently use heat pipes with diameters of 1-1.2mm, but NEC's has a tiny 0.6mm diameter. Due to Apple's tiny screens, that may have to be even smaller for upcoming devices.

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4 user comments

121.6.2013 14:44

I wanna see someone set up water cooling on this...lol


Just my $0.02,

dEwMe

221.6.2013 15:04

I had no idea heat pipes could work at such small diameters.


Its a lot easier being righteous than right.


DSE VZ300-
Zilog Z80 CPU, 32KB RAM (16K+16K cartridge), video processor 6847, 2KB video RAM, 16 colours (text mode), 5.25" FDD

322.6.2013 20:03

nice!

424.6.2013 1:29

Save the chip, burn your leg off.

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