Atmel Introduces the Industry's First 128K-bit Serial EEPROM in an 8-pin Ultra Thin MLP (2 x 3mm) Leadless Package

SAN JOSE, California, July 9 /PRNewswire/ --

- New Package Offers 33% Thickness Savings

Atmel(R) Corporation (Nasdaq: ATML) announced today the industry's first
128K-bit Serial EEPROM device in an 8-pin ultra thin MLP (2 x 3mm) leadless
package with overall height of 0.60mm.

The 8-pin ultra thin MLP (2 x 3 x 0.60mm) package is now offered in
densities from 1K-bit to 128K-bit for the 2-wire Serial EEPROM (AT24) and
1K-bit to 64K-bit in the SPI Serial EEPROM (AT25) family. This package is
ideal for compact and portable consumer applications such as MP3 players,
digital cameras and remote controls. In addition, the MLP package is ideal
for a wide range of height constrained communication applications including,
Bluetooth modules and mobile phones. Traditionally, the MLP (2 x 3mm) package
has been limited to low density Serial EEPROM devices. Atmel is the first to
market this package for high-density Serial EEPROM devices up to 128K-bit.
Previously, the highest available density by the industry in a 2X3 mm MLP
was a 32K Serial EEPROM.

"Fitting a 128K-bit Serial EEPROM in an ultra thin MLP package offers
designers with maximum flexibility, in board space savings and overall
height, while maintaining the capability to migrate up in density from 1K-bit
up to 128K-bit without changing the board layout," said Bassam Khoury,
Managing Director for the Serial Interface Product Line. "Atmel's leading
edge technology enabled us to accomplish this breakthrough in package
technology."

Availability

The ultra thin MLP (2 x 3mm) package is available now in densities from
1K-bit up to 128K-bit in the 2-wire family and 1K-bit up to 64K-bit in the
SPI family. The 8-pin MLP package is offered in a Pb-Free (Green),
Halogen-Free and RoHS compliant packaging with the industry's high
reliability NiPdAu finish.

About Atmel

Atmel is a worldwide leader in the design and manufacture of
microcontrollers, advanced logic, mixed-signal, nonvolatile memory and radio
frequency (RF) components. Leveraging one of the industry's broadest
intellectual property (IP) technology portfolios, Atmel is able to provide
the electronics industry with complete system solutions focused on consumer,
industrial, security, communications, computing and automotive markets.

(C) 2007 Atmel Corporation. All Rights Reserved. Atmel(R), logo and
combinations thereof, and others, are registered trademarks, or trademarks of
Atmel Corporation or its subsidiaries. Other terms and product names may be
trademarks of others.

Information:

For more information on Atmel's MLP packages in a 128K density, go to:
http://www.atmel.com/dyn/products/product_card.asp?family_id=647&family_n
ame=Serial+EEPROM&part_id=4073

For more information on Atmel's EEPROM products, go to:
http://www.atmel.com/atmel/products/prod6.htm

Press Contacts:
    Bassam Khoury, Managing Director of Serial Interface Products
    Phone: +1-408-436-4241, Email: bkhoury@atmel.com
    Helen Perlegos, Public Relations - USA and Asia Pacific Rim
    Phone: +1-408-487-2963, Email: hperlegos@atmel.com
    Veronique Sablereau, Corporate Communications Manager - Europe
    Phone: +33-1-30-60-70-68, Fax: +49-71-31-67-24-23
    Email: veronique.sablereau@atmel.com