Carsem Selects Eagle Test Systems for Parallel Mixed-Signal and Analog Test

BUFFALO GROVE, Illinois, August 31 /PRNewswire/ --

Eagle Test Systems, Inc. (Nasdaq: EGLT), announced that Carsem, a leading
provider of turn-key assembly and test services including wafer probe, final
test, product engineering and test program/hardware development for the
semiconductor industry, has selected Eagle Test Systems as their mixed-signal
and analog platform of choice for true parallel multi-site test.

Carsem plans to utilize the Eagle Test platform in their development and
production facilities for Power Management, Industrial, Automotive, and some
Data Converter device test applications. Eagle Test was chosen based on a set
of Carsem specific criteria which includes installed base, long term
viability, OEE performance, test economics, and global support capabilities.

"The Eagle Test platform enables us to offer parallel, multi-site testing
to address a wide range of customers' products with superior cost-of-test
economics," said WT Chim, General Manager of Test Operations for Carsem
Malaysia. "Eagle's parallel capabilities were a key factor in our decision
process. With multiple facilities in Malaysia and China, Eagle continues to
demonstrate their commitment to Carsem's success."

"Since Carsem is a major player in the assembly and test of MLP products,
the decision to name Eagle their platform of choice speaks very highly of our
ability to deliver high volume test solutions," stated Dale Buxton, Vice
President Asian Operations for Eagle Test. "We consider Carsem to be an
extremely valuable relationship and look forward to sharing continued
success."

About Eagle Test Systems, Inc.

Eagle Test designs, manufactures, sells and services high-performance
automated test equipment for the semiconductor industry. The company's
products are used to test analog, mixed-signal and radio frequency (RF)
semiconductors that are used in products such as digital cameras, MP3
players, automotive electronics, cellular telephones, computers and
peripherals. The company was founded in 1976 and has offices located
throughout the world in Asia, North America and Europe, with corporate
headquarters in Buffalo Grove, Illinois. Please visit
http://www.eagletest.com for more information.

About Carsem

Carsem is a leading provider of turnkey packaging and test services to
the semiconductor industry, and offers one of the widest ranges of package &
test portfolios in the world. To meet the growing demands of the
telecommunications and wireless markets for smaller, faster,
thermally-efficient devices, Carsem's portfolio includes several advanced
technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball
Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP 
(System-in-Package) capability. Carsem also offers a full range of turnkey
test services for RF, mixed-signal, linear, digital and power devices. Our
factories maintain world-class quality standards having achieved SAC Level 1,
ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with
a global network of sales and engineering support offices. Carsem is a member
of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou,
China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc.
sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts
Valley, CA 95066, phone +1-831-438-6861, fax +1-831-438-6863, web site:
http://www.carsem.com.

Contact: Stephen Hawrysz
             +1-847-327-1038

    Web site: http://www.eagletest.com
              http://www.carsem.com