HEILBRONN, Germany, March 3 /PRNewswire/ --

Atmel(R) Corporation (Nasdaq: ATML) announced today the availability of a 
new System-in-Package (SiP) solution for LIN automotive networking 
applications. The ATA6617, featuring maximum integration, is the first member 
of an upcoming LIN SiP family. It combines Atmel's LIN System Basis Chip 
(SBC) ATA6624 - including LIN transceiver, voltage regulator, watchdog - and 
a well-known AVR(R) microcontroller (ATtiny167 with 16k flash memory) in a 
single package. With this highly integrated solution, customers can create 
complete LIN nodes using just one IC.

The new LIN SiP is based on Atmel's second-generation LIN IP with 
excellent EMC and ESD performance. It is optimized for low-cost LIN slave 
applications and enables system cost reductions of up to 25%. A powerful LIN 
UART with integrated hardware routines simplifies protocol stack handling and 
limits the interrupt generation, thus reducing the microcontroller load and 
flash memory consumption. Simple assignment of an individual physical LIN node 
address, which is important in applications such as air-conditioning systems, 
can be realized by using an integrated 100 microampere current source.

One important criteria for LIN applications is low current consumption. 
To ensure that the LIN node's current consumption is well below 100 microampere 
in applications that are continuously connected to the battery, the ATA6617 
provides several current saving modes where different functionalities are 
individually switched off or on, depending on the application requirements.

All pins of the LIN system basis chip and the microcontroller are bonded 
out, thus providing customers the same flexibility and performance for their 
applications as with discrete parts.

Thanks to the extremely small QFN38 package, measuring only 5 mm x 7 mm, 
designers can save more than 50% of PCB size compared to conventional 
solutions.

Availability and Pricing

Samples of the new LIN IC ATA6617 are now available in small QFN38 
packages. Pricing starts at US $1.89 for 10k-piece quantities. Various
cost-effective tools support designers with the development of LIN networks.
A development board is available that enables a quick start with the IC and
allows prototyping and testing of new designs. Certified LIN 2.0 and 2.1
protocol stacks from leading suppliers are also available. Further LIN SiP
family members, including an 8 kB flash memory version, will be announced in
Q2 2009.

Footnote
    EMC = Electro-Magnetic-Compatibility
    ESD = Electronic Static Discharge
    IP = Intellectual Property
    LIN = Local Interconnect Network
    PCB = Printed Circuit Board
    QFN = Quad Flat No leads
    SBC = System Basis Chip
    SiP = System-in-Package



About Atmel

Atmel is a worldwide leader in the design and manufacture of 
microcontrollers, advanced logic, mixed-signal, nonvolatile memory and radio
frequency (RF) components. Leveraging one of the industry's broadest
intellectual property (IP) technology portfolios, Atmel is able to provide
the electronics industry with complete system solutions focused on consumer,
industrial, security, communications, computing and automotive markets.

(c) 2009 Atmel Corporation. All Rights Reserved. Atmel(R), Atmel logo 
and combinations thereof, AVR(R) and others are registered trademarks or 
trademarks of Atmel Corporation or its subsidiaries. Other terms and product 
names may be trademarks of others.

Information:

Product information on Atmel's LIN SiP IC ATA6617 may be
retrieved at: http://www.atmel.com/dyn/products/product_card.asp?part_id=4522

Press Contacts:
    Dr. Susanne van Clewe, Marcom Director Automotive
    Phone: +49-7131-67-2081, Email: susanne.van-clewe@atmel.com

    Helen Perlegos, Public Relations
    Phone: +1-408-487-2963, Email: Helen.perlegos@atmel.com