TOKYO and HSIN-CHU, Taiwan, August 27 /PRNewswire/ --

Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing
Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that they have agreed
to collaborate on 28-nanometer (nm) process technology targeted for foundry
production of Fujitsu Microelectronics' 28nm logic ICs and to jointly develop
an enhanced 28nm high-performance process technology by utilizing TSMC's
advanced technology platform. Previously, both companies announced that
Fujitsu Microelectronics will collaborate with TSMC on 40nm production. This
will extend Fujitsu Microelectronics' 40nm collaboration with TSMC and covers
joint development of an optimized 28nm high-performance process technology.
Initial 28nm samples are expected to ship toward the end of 2010.

This collaborative effort combines Fujitsu Microelectronics' expertise
and strength in advanced high-speed process and low-power design technologies
with TSMC's expertise and strength in power-efficient high- performance
logic/SoC process and leading-edge technology platform that is part of the
Open Innovation Platform(TM) from TSMC. Extending the collaboration to 28nm
will provide the opportunity for both companies to capitalize on a
competitive and high-performance 28nm technology based on TSMC's 28nm
technology portfolio that includes high-performance and low-power
applications.

The two companies are also discussing possibilities for collaborating on
advanced packaging that could include joint developments that combine Fujitsu
Microelectronics' strengths in high-performance lead-free and ultra-high-pin
count packaging technologies, with TSMC's strength in chip-package
integration and advanced Cu/ELK interconnect.

"We are rapidly progressing in our previously-announced collaboration
with TSMC on 40nm process technology, with several product designs in
progress at present," said Haruyoshi Yagi, Corporate Senior Vice President of
Fujitsu Microelectronics Limited. "With this further agreement with TSMC on
28nm high-performance process technology development and production, we
combine both companies' strengths to create greater value for our customers,
and will further drive the growth of businesses for TSMC and Fujitsu's ASIC
and ASSP (*1) core products."

"Fujitsu Microelectronics selected TSMC as a partner based in part on
TSMC's unsurpassed record of developing and ramping advanced technologies.
The agreement today is also a vote of confidence in TSMC's technology
platforms that include design related considerations such as design kits,
design flows, TSMC and 3rd party IP; robust device related documentation,
processes technology excellence and backend assembly and test capabilities,"
said Jason Chen, Vice President, Worldwide Sales and Marketing, TSMC.

Notes:
    *1: ASIC and ASSP
    ASIC: Application specific IC. Customized ICs for specific applications
    (customers).
    ASSP: Application specific standard product. IC products for specific
    applications, such as image processing and network-related processing.

    Fujitsu Microelectronics Customer Contact:
    Fujitsu Microelectronics Limited
    Business Management Division
    Inquiries:
 https://www-s.fujitsu.com/global/services/microelectronics/contact/form.html



About Fujitsu Microelectronics Limited (FML)

Fujitsu Microelectronics Limited designs and manufactures semiconductors,
providing highly reliable, optimal solutions and support to meet the varying
needs of its customers. Products and services include ASICs/COT, ASSPs, power
management ICs, and flash microcontrollers, with wide-ranging expertise
focusing on imaging, wireless, automotive and security applications. Fujitsu
Microelectronics also drives power efficiency and environmental initiatives.
Headquartered in Tokyo, Fujitsu Microelectronics Limited was established as a
subsidiary of Fujitsu Limited on March 21, 2008. Through its global sales and
development network, with sites in Japan and throughout Asia, Europe, and the
Americas, Fujitsu Microelectronics offers semiconductor solutions to the
global marketplace. For more information: http://jp.fujitsu.com/fml/en/

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest portfolio
of process-proven libraries, IPs, design tools and reference flows. The
Company's total managed capacity in 2008 exceeded 9 million (8-inch
equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs
(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned
subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC
is the first foundry to provide 40nm production capabilities. Its corporate
headquarters are in Hsinchu, Taiwan. For more information about TSMC please
visit www.tsmc.com.

All company or product names referenced herein are trademarks or
registered trademarks of their respective owners. Information provided in
this press release is accurate at time of publication and is subject to
change without advance notice.